(module Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.8x1.3mm_ThermalVias (layer F.Cu) (tedit 5A6B2D68)
  (descr http://ww1.microchip.com/downloads/en/DeviceDoc/mic2290.pdf)
  (tags "mlf 8 2x2 mm")
  (attr smd)
  (fp_text reference REF** (at 0.4 -2.39) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.8x1.3mm_ThermalVias (at 0 4.7) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 0.5 0.5) (thickness 0.075)))
  )
  (fp_line (start -1.38 -1.15) (end 1.38 -1.15) (layer F.SilkS) (width 0.1))
  (fp_line (start 1.38 -1.15) (end 1.38 1.14) (layer F.SilkS) (width 0.1))
  (fp_line (start 1.38 1.14) (end -1.380018 1.14) (layer F.SilkS) (width 0.1))
  (fp_line (start -1.38 -1.150021) (end -1.38 1.14) (layer F.SilkS) (width 0.1))
  (fp_line (start -1.58 -0.92) (end -1.58 -1.35) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.15 -1.35) (end -1.58 -1.35) (layer F.SilkS) (width 0.15))
  (fp_line (start -1 -0.39) (end -0.389919 -1.000081) (layer F.Fab) (width 0.1))
  (fp_line (start -0.39 -1) (end 1 -1) (layer F.Fab) (width 0.1))
  (fp_line (start 1 1) (end 1 -1) (layer F.Fab) (width 0.1))
  (fp_line (start 1 1) (end -1 1) (layer F.Fab) (width 0.1))
  (fp_line (start -1 -0.38) (end -1 1) (layer F.Fab) (width 0.1))
  (fp_line (start -1.35 -1.25) (end 1.35 -1.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.35 -1.25) (end -1.35 1.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start 1.35 1.25) (end 1.35 -1.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start 1.35 1.25) (end -1.35 1.25) (layer F.CrtYd) (width 0.05))
  (pad 1 smd rect (at -0.9 -0.75) (size 0.4 0.23) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -0.9 -0.25) (size 0.4 0.23) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -0.9 0.25) (size 0.4 0.23) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -0.9 0.75) (size 0.4 0.23) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 0.9 0.75) (size 0.4 0.23) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 0.9 0.25) (size 0.4 0.23) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 0.9 -0.25) (size 0.4 0.23) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 0.9 -0.75) (size 0.4 0.23) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 0 0) (size 0.8 1.3) (layers F.Cu F.Mask))
  (pad 9 thru_hole circle (at 0 -0.35) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
  (pad 9 thru_hole circle (at 0 0.35) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
  (pad "" smd rect (at 0 -0.35) (size 0.55 0.55) (layers F.Paste))
  (pad "" smd rect (at 0 0.35) (size 0.55 0.55) (layers F.Paste))
  (pad 9 smd rect (at 0 0) (size 0.8 1.3) (layers B.Cu))
  (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.8x1.3mm_ThermalVias.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
