(module MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm_ThermalVias (layer F.Cu) (tedit 5AE80613)
  (descr "8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)")
  (tags "DFN MLF 0.65")
  (attr smd)
  (fp_text reference REF** (at 0 -2.55) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm_ThermalVias (at 0 2.55) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start 1.61 1.61) (end 1.61 1.35) (layer F.SilkS) (width 0.12))
  (fp_text user %R (at 0 0) (layer F.Fab)
    (effects (font (size 0.7 0.7) (thickness 0.105)))
  )
  (fp_line (start -0.75 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1))
  (fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1))
  (fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.1))
  (fp_line (start -1.5 1.5) (end -1.5 -0.75) (layer F.Fab) (width 0.1))
  (fp_line (start -1.5 -0.75) (end -0.75 -1.5) (layer F.Fab) (width 0.1))
  (fp_line (start 1.85 -1.75) (end 1.85 1.75) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.85 1.75) (end 1.85 1.75) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.61 1.61) (end 1.61 1.61) (layer F.SilkS) (width 0.12))
  (fp_line (start -1.61 -1.61) (end 1.61 -1.61) (layer F.SilkS) (width 0.12))
  (fp_line (start -1.61 1.61) (end -1.61 1.35) (layer F.SilkS) (width 0.12))
  (fp_line (start 1.61 -1.61) (end 1.61 -1.35) (layer F.SilkS) (width 0.12))
  (fp_line (start -1.85 -1.75) (end 1.85 -1.75) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.85 -1.75) (end -1.85 1.75) (layer F.CrtYd) (width 0.05))
  (pad 9 smd rect (at 0 0) (size 1.55 2.3) (layers B.Cu))
  (pad 1 smd rect (at -1.36 -0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -1.36 -0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -1.36 0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -1.36 0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 1.36 0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 1.36 0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 1.36 -0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 1.36 -0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 0 0) (size 1.55 2.3) (layers F.Cu F.Mask))
  (pad "" smd rect (at 0 0.9) (size 1.5 0.4) (layers F.Paste))
  (pad 9 thru_hole circle (at 0 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
  (pad 9 thru_hole circle (at 0 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
  (pad "" smd rect (at 0 -0.9) (size 1.5 0.4) (layers F.Paste))
  (pad "" smd rect (at 0 0) (size 1.5 0.65) (layers F.Paste))
  (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
